Aluminum-Copper¶

The Aluminum-Copper examples demonstrate the 2D solidification of a binary aluminium copper alloy. The T01_07_AlCu_D_Dendrites_2D_TQ example corresponds to a directional solidification situation, whereas T01_02_AlCu_E_Dendritic_2D_TQ and T01_05_AlCu_E_Temp1d_2D_TQ, resp. A002_AlCu_Temp1d, describe equiaxed solidification.

All these examples are concentration-coupled with Thermo-Calc™ coupling. T01_02_AlCu_E_Dendritic_2D_TQ and T01_05_AlCu_E_Temp1d_2D_TQ provide an example of the use of the seed density nucleation model. Additionally A002_AlCu_Temp1d demonstrates the reading of data files for temperature-dependent mobilities and latent heat as well as the use of the far field approximation for temperature coupling and release of latent heat. Another feature of this example is the use of categorized seeds.

Alloy¶

Simulation conditions¶

Results¶

Concentration¶

T01_07_AlCu_D_Dendrites_2D_TQ Cu concentration at $t = 2s$

T01_02_AlCu_E_Dendritic_2D_TQ Cu concentration at $t = 2s$

A002_AlCu_Temp1d Cu concentration at $t = 0.4 s$

Solidification¶

T01_07_AlCu_D_Dendrites_2D_TQ solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1

$t = 0s$	$t = 0.1s$

$t = 0.5s$	$t = 1.0s$

$t = 1.5s$	$t = 2.0s$

T01_02_AlCu_E_Dendritic_2D_TQ solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1

$t = 0s$	$t = 0.1s$

$t = 0.5s$	$t = 1.0s$

$t = 1.5s$	$t = 2.0s$

A002_AlCu_Temp1d solidification sequence

$-1$: interface, $0$: liquid, $1$: fcc_A1, $2$: AlCu_THETA

$t = 0s$	$ t= 9.0000004E \cdot 10^{-2}s$

$t = 0.1s$	$t = 0.3s$

$t = 0.4s$	$t = 0.5s$

Files¶

• T01_07_AlCu_D_Dendrites_2D_TQ
• T01_02_AlCu_E_Dendritic_2D_TQ
• A002_AlCu_Temp1d