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Aluminum-Copper

The Aluminum-Copper examples demonstrate the 2D solidification of a binary aluminium copper alloy. The T003_AlCu example corresponds to a directional solidification situation, whereas T002_AlCu_Equiaxed and A002_AlCu_Temp1d describe equiaxed solidification.

All three examples are concentration-coupled with Thermo-Calc™ coupling. T002_AlCu_Equiaxed and A002_AlCu_Temp1d provide an example of the use of the seed density nucleation model. Additionally A002_AlCu_Temp1d demonstrates the reading of data files for temperature-dependent mobilities and latent heat as well as the use of the far field approximation for temperature coupling and release of latent heat. Another feature of this example is the use of categorized seeds.

Alloy

ExampleT003_AlCuT002_AlCu_EquiaxedA002_AlCu_Temp1d
Alloy systemAl-Cu (Al_Cu.Ges5)
Composition
  • 97 at% Al
  • 3 at% Cu
Transitionsolidification

Simulation conditions

ExampleT003_AlCuT002_AlCu_EquiaxedA002_AlCu_Temp1d
Dimension2-D
Grid size300x300 cells200x200 cells
Grid spacing2 microns0.5 microns
Interface thickness4 cells3.5 cells
Boundary conditions Phase field
  • east = symmetric
  • west = symmetric
  • top = symmetric
  • bottom = symmetric
Phase field
  • east = periodic
  • west = periodic
  • top = periodic
  • bottom = periodic
Phase field
  • east = periodic
  • west = periodic
  • top = insulation
  • bottom = insulation
Solid phasesfcc_Alfcc_Al, AlCu_THETA

Results

Concentration

T003_AlCu Cu concentration at t = 2s

T002_AlCu_Equiaxed Cu concentration at t = 2s

A002_AlCu_Temp1d Cu concentration at t = 0.4 s

Solidification

T003_AlCu solidification sequence

-1: interface, 0: liquid, 1: fcc_A1

t = 0s t = 0.1s
t = 0.5s t = 1.0s
t = 1.5s t = 2.0s

T002_AlCu_Equiaxed solidification sequence

-1: interface, 0: liquid, 1: fcc_A1

t = 0s t = 0.1s
t = 0.5s t = 1.0s
t = 1.5s t = 2.0s

A002_AlCu_Temp1d solidification sequence

-1: interface, 0: liquid, 1: fcc_A1, 2: AlCu_THETA

t = 0s $ t= 9.0000004E \cdot 10^{-2}s$
t = 0.1s t = 0.3s
t = 0.4s t = 0.5s

Files